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Such elements as capacitor, inductor, resistor & etc. The technology that is developed as the result of lightness, thinness, shortness & smallness of PCB based on the high density trend of SMD. The technology embeds parts in the surface of circuit board in order to overcome the limit of mounting space of functional parts. Environment friendliness & low cost are the merits of the technology and the technology is in limelight as the high-end technology.
 
Process Specifications
Layer: 6~8Layer
Base Material: FCCL, Low Regin Prepreg, Coverlay
Thickness: 0.60mm~ 0.80mm
Trace Width / Space: 0.075mm / 0.075mm
Min. Hole Size: 0.15mm (Mechanical), 0.10mm (Laser)