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Item
2011
2012
2013
Min. Pattern Width/Space
40㎛/40㎛
30㎛/30㎛
25㎛/25㎛
Min.
Hole Size
Mechanical
100㎛
100㎛
90㎛
Laser
CO₂
BVH
120㎛
100㎛
80㎛
UV
100㎛
80㎛
70㎛
UV
PTH
50㎛
40㎛
30㎛
Min. Land Diameter (Mechanical)
300㎛
280㎛
250㎛
Layer Count
8 Layers
10 Layers
12 Layers
PSR Alignment Tolerance
60㎛
50㎛
40㎛
Surface Treatment
Electroless Tin
0.6㎛ ↑
0.6㎛ ↑
0.6㎛ ↑
Electrolytic Ni/Au
Ni 5±1㎛
Au 0.5㎛
Ni 5±0.5㎛
Au 0.5㎛
Ni 5±0.5㎛
Au 0.5㎛
Electroless Ni/Au
Ni 3±1㎛
Au 0.03㎛
Ni 3±0.5㎛
Au 0.03㎛
Ni 3±0.5㎛
Au 0.03㎛
 
Min. Pattern Width/Space
Newflex is holding high density circuit manufacturing technology by developing & succeeding FPCB for color liquid display module which is national project through its own efforts. Currently, Newflex is trying to realize high density circuit through systematic research for high resolution photo mask & thin type raw materials.
Min. Hole Size
Based on the trends of light, thin, short & small of electronics parts, circuit is becoming high density & Via Hole Size which connects circuit is decreasing. Newflex is under researching for high speed drilling technology & cutting edge CO2 & UV Laser Drilling Technology as well as seeking optimization of Diameter for the minimization of Via Hole Size.
Layer Count
Along with the trends of light, thin, short & small of electronics parts, the trends of circuit board is also changed to multi function & multi performance . As the result, the size of circuit board is decreasing while the layer is increasing. NewFlex has secured optimum layering technology by minimizing flexibility ratio and miss-alignment between layers which is generated when increases layers. NewFlex is under researching for high multi layer FPCB manufacturing method.
PSR Alignment Tolerence
Except for the part that mounts parts or terminal part that is connected to connector, all the surface of circuit board is coated by PSR. When coats, it is very important to maintain constant tolerance without shielding terminal part & more precise alignment tolerance is required based on the high density of circuit. NewFlex is preventing PSR Miss-alignment & improving tolerance through the process management & improvement.
Surface Treatment
As the surface treatment of circuit board, NewFlex is applying various surface treatment methods such as Electrolytic Ni/Au, Electroless Ni/Au & Tin Plating in order to correspond to pb-Free current and silver plating will be applied to around 2007. In addition, NewFlex is maintaining & improving surface situation as optimum state through systematic process management with pretreatment process.
Embedded passive
If passive element which is mounted to surface of circuit board is embedded in the circuit board, the cost of part mounting is saved & bad effect to environment is decreased by eliminating soldering parts. NewFlex has successfully performed national project such as Embedded Resistor for cell phone & Capacitor Rigid-flexible PCB development. As the result, NewFlex secured embedded passive element design technology & embedded passive element formation & measuring technology. In addition, by holding library by capacity & Resistor, NewFlex built up competitiveness for the future requirement of lightness, thinness, shortness & smallness and is proceeding R&D in order to develop higher capacity passive element.