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  NewFlex’s Research Institute was established in Oct.14th,2003 and finished its establishment on Dec.1st,2003 by being selected as the 2nd developer of components & materials technology development business ( Embedded Passive ) which was managed by MOCIE.

Major duties are new product development ,product design and development of essential technology. In particular, the institute has been trying to produce competitive products by developing NewFlex’s own essential technology.


Material Development Technical Development
Chip on Film
- Single Side FPCB 20㎛/20㎛
- Double Side FPCB 40㎛/40㎛
Build Up
IVH(Interstitial Via Hole) Embedded Register for cell phone, Capacitor
Development of rigid flexible PCB
- Embedded Passive
   ( Burried Capacitors, Burried Resisor)
Optical FPCB
Development of FPCB for module of color crystal liquid display Rigid-Flexible PCB

Product Name
Technology
Intellectual Property
Single Side FPCB
- Technology of Roll to Roll Exposure & Circuit Formation
- Circuit Inspection Technology of High Density Circuit
- Jig Manufacturing Technology
Manufacturing
Method of FPCB
Double Side FPCB
- Circuit Formation Technology of High Density Circuit
- Micro Via Hole Formation Technology
- Partial Copper Plating Technology
- Surface Treatment Technology
Partial Coating
Method of FPCB
Multi Layer FPCB
- High Flexibility Product Design Technology
- Lamination Technology
- Noise Prevention Technology
Partial Coating
Method of FPCB
Rigid-Flexible
PCB
- Lamination Technology
- PSR Formation Technology
- External Shape Processing Technology
- BVH Formation Technology
Partial Coating
Method of FPCB


Optical Fiber Embedded Rigid-Flexible PCB

Expected Effect : Used to Cable & Wireless Telecommunication System which require high speed & high
                 volume data , PC Home Automation & Mobile Devices

Embedded Passive Rigid-Flexible PCB

Expected Effect : Once passive element is mounted on the built-in circuit board, the size of board is
                 decreased & leads are disappeared because passive elements are not surface mounted.
                 Connection length of other chips & passive elements are shortened.

Build-Up (MBL)

Expected Effect : Securing of design & processing technology of Build-up PCB products. Expecting cost down                  due to superior space efficiency


Roll to Roll Exposure & Circuit Formation Technology, Circuit Formation Technology of High Density Circuit, Circuit Inspection Technology of High Density Circuit, Jig Manufacturing technology, Micro Via Hole Formation Technology, Partial Copper Plating Technology, High flexibility product Design Technology, Lamination Technology, PSR Formation Technology, Surface Treatment Technology, Noise Prevention Technology & External Shape Processing Technology